FlexICs Opens Fabrication Facility for Semiconductors on Plastic Manufacturing
MILPITAS, Ca. - June 26, 2001 - FlexICs, Inc., a pioneer in Ultra Low Temperature PolySilicon (ULTPS) processing on plastic, today announced the opening of its pilot fabrication facility for producing semiconductors on plastic. The technology makes possible next-generation communications, computing and consumer products that can benefit from intelligent, rugged electronic circuitry and thin, shatterproof and flexible displays.
The opening of our fabrication facility is an important milestone for the commercialization of our semiconductor-on-plastic technology and takes advantage of the rapid adoption of portable electronics in our daily lives, said Magnus Ryde, Chairman and CEO. Our technology will enable these products to be lighter, more durable, and thinner. Consequently, we see the possibility of a major shift in the way humans interact with electronic devices coming.
The 18,000-square-foot facility features a Class 100 clean room with special equipment designed for making semiconductors on plastic at ultra low temperatures.
We are delighted to have completed our fab in record time, said Heiner Eichermueller, FlexICs Vice President of Operations. With the teamwork of our employees, vendors, contractors and help from City of Milpitas planning and permit personnel, we were able to accelerate the fab completion by three months. We are now ready to help our customers build exciting new products using this unique technology.
About FlexICs
FlexICs is a leading developer of Ultra Low Temperature PolySilicon (ULTSP) processing that allows semiconductors to be built on plastic. This breakthrough technology will enable shatterproof, lightweight, thin and flexible displays for next generation PDAs, cell phones and notebooks PCs. Other applications include memory modules, optical component integration and imaging. FlexICs (www.flexics.com) is headquartered in Milpitas, California.
Press Contact
Paula Harvan
FlexICs Public Relations
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