FlexICs Announces New Vice President of Process Development

Dr. Paul G. Carey to Direct Process Development for Semiconductors on Plastic
Dr. Patrick M. Smith to Direct Design and Test Engineering Department

MILPITAS, Ca. - June 22, 2001 - FlexICs, Inc., a pioneer in Ultra Low Temperature PolySilicon (ULTPS) processing on plastic, named Dr. Paul G. Carey as Vice President of Process Development. Carey, with extensive experience in the fabrication of Thin Film Transistors (TFTs) on plastic, will help accelerate the commercialization of the company’s technology for producing intelligent, rugged electronic circuitry and thin, shatterproof displays. Dr. Patrick M. Smith has been named Vice President of Design and Test Engineering.

“Paul’s expertise in process development and integration is of tremendous value as we begin manufacturing semiconductors on plastic at our new fabrication facility,” said Magnus Ryde, Chairman and CEO. “With Paul’s addition we can now expand our technical capabilities to address commercialization issues of our technology such as design and test engineering, and I am very pleased that Pat will now focus on this area.”

Carey comes to FlexICs from Applied Materials, where he served as Director of Advanced Annealing Technology for the Transistor and Capacitor Group. Previously, Carey worked at Lawrence Livermore National Laboratory (LLNL) developing low temperature and pulsed laser semiconductor processing technology. There he worked on a Defense Advanced Research Project Agency (DARPA) program for the Department of Defense to fabricate TFTs on plastic. Carey is a co-founder of FlexICs and has been a technical advisor to the company since its inception.

Carey has a doctorate in materials science engineering from Stanford University and a master’s degree in electrical engineering from the University of California at Berkeley. He has written technical papers that have appeared in more than 40 publications and holds seven patents with additional patents pending.

Smith has worked at LLNL as a Staff Scientist for DARPA’s TFTs on plastic program. With an expertise in laser processing, he developed techniques and systems for fabricating TFTs on plastic. Smith also designed the electrical characterization and device test systems to evaluate TFT and circuit performance. He is a co-founder of FlexICs. Smith has a doctorate and a master’s degree in applied physics from Harvard University.

About FlexICs

FlexICs is a leading developer of Ultra Low Temperature PolySilicon (ULTSP) processing that allows semiconductors to be built on plastic. This breakthrough technology will enable shatterproof, lightweight, thin and flexible displays for next generation PDAs, cell phones and notebooks PCs. Other applications include memory modules, optical component integration and imaging. FlexICs (www.flexics.com) is headquartered in Milpitas, California.

Press Contact

Paula Harvan
FlexICs Public Relations